-- The Consumer Electronics Innovation Congress 2026 (CEIC2026) was held at the Shenzhen Convention and Exhibition Center (Futian) from October 22 to 24. Bringing together industry representatives from 78 countries and regions, the congress served as a global platform for advancing consumer electronics innovation, industry collaboration, and AI-driven transformation.
CEIC2026 featured an extensive program comprising three main forums, more than 20 sub-forums, and a 20,000-square-meter exhibition. More than 300 companies participated as exhibitors, while cumulative attendance across the congress and exhibition reached 53,900 visits over three days. More than 20,000 visits were recorded on the opening day alone.
The event also convened more than 30 academicians and experts, alongside over 300 industry leaders, technology specialists, and investment representatives, for discussions on AI-driven transformation and emerging consumer experiences.
Three Main Forums Advanced Technology, Industry and AI Collaboration
The three main forums addressed technological breakthroughs, industrial development, and AI innovation in the Greater Bay Area. Key publications included Top 10 Trends in Consumer Electronics and Top 10 Global Computing Power Trends 2027.
Eight industry organizations jointly launched the (PI)² Physical Intelligence Partnership Initiative, aimed at promoting deeper integration between physical intelligence and consumer electronics.
At the Industrial Development Forum, several international organizations signed memoranda of understanding, while the results of the NIDA Pioneer Program were unveiled. Participating companies also presented practical applications of emerging technologies in areas such as AI-powered vehicles and intelligent spaces.
Beyond the Main Forums: Thematic Sessions and Interactive Experiences
More than 20 sub-forums explored wireless connectivity, Network 2030, embodied intelligence, digital health, AI-powered UHD technologies, 3D spatial imaging, and the low-altitude economy.
On the opening day, the finals of the 3rd SparkLink & OpenHarmony Cup Innovation Game were held alongside the congress. Major releases included the SparkLink 3.0 standard, 15 recommended national standards, and the Blue Paper on the Evolution of SparkLink SLE 3.0 Technical Standards.
The Vivid Immersive Park, built around UWA’s Vivid audiovisual technology ecosystem and presented through traditional Chinese music, showcased an end-to-end application framework covering standards, content capture, production, encoding, transmission, decoding, rendering, and playback.
The Open Stage connected industry experts, entrepreneurs, and investors through the Luminary’s Roundtable, Venture Capital Matchmaking, and developer Codelabs. Twelve hard-tech projects joined investment roadshows, alongside live demonstrations of edge AI terminals, exoskeleton robots, and AI-powered smart rings.
Exhibition Showcased Innovation Across the Consumer Electronics Value Chain
CEIC2026 brought together more than 300 companies, presenting advances across the consumer electronics value chain, from chips and operating systems to intelligent devices and industry applications.
Foundational technologies and connected ecosystems took center stage. AllianceHub, a one-stop digital collaboration platform for international standards organizations and industry alliances, was officially launched. HiSilicon Technologies introduced a distributed collective intelligence solution integrating OpenHarmony and SparkLink, while more than 30 SparkLink ecosystem partners displayed hundreds of products and solutions, including next-generation chips. GIIC featured HarmonyOS-based industrial applications, including Hualong Xunda's AI-powered flexible production line, while the OneConnect smart home area demonstrated cross-brand device interoperability.
AI-powered devices and immersive experiences were among the major attractions. China Media Group presented its CCTV Audio-Visual Large Model 3.0, while Jupiter SR. showcased glasses-free 3D display technologies. Smart vehicles from NIO, XPeng, and GAC highlighted advances in intelligent mobility. It also featured EHang's EH216-S pilotless passenger-carrying eVTOL aircraft and ZEROG's ZG-ONE eVTOL, designed for low-altitude tourism and sightseeing. Humanoid robots, exoskeletons, AI PCs, and smart sports glasses offered visitors a closer look at emerging consumer applications.
Industry-focused demonstrations highlighted the expanding reach of intelligent technologies. WAA presented immersive scenarios covering smart homes, healthcare and elderly care, and smart airports, while GCC demonstrated AI applications for the electric power sector. These technologies also found applications in industrial security, mining, government services, and retail, with demonstrations ranging from smart safety helmets to AI-powered self-service terminals.
Together, these exhibits illustrated how advances in connectivity, computing, and AI are moving beyond individual devices to enable more integrated consumer experiences and broader industrial applications.
Advancing Global Consumer Electronics Innovation Through Foundational Technologies
CEIC2026 reinforced Shenzhen's role as a hub for global consumer electronics collaboration, connecting advances in foundational technologies and open standards with real-world applications. As AI continues to reshape the industry, the congress demonstrated how cross-border partnerships can accelerate the next generation of intelligent products and experiences.
Co-organizers
The Consumer Electronics Innovation Congress 2026 (CEIC2026) was jointly organized by the following eight organizations:
International SparkLink Alliance (iSLA)
UHD World Association (UWA)
Global Intelligent IoT Consortium (GIIC)
World WLAN Application Alliance (WAA)
Global Computing Consortium (GCC)
Network Innovation and Development Alliance (NIDA)
Comentropy Industry and Standards Innovation Service Center (Comentropy)
Center for International Economic and Technological Cooperation, Ministry of Industry and Information Technology (CIETC)
Contact Info:
Name: Charity Bi
Email: Send Email
Organization: Syc-inno
Website: https://www.ceic.net/en
Release ID: 89207590
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